Description
MULTIPLAN-50 FI is used for smoothening and levelling in layers of 1-50 mm thick. Suitable substrates are concrete floors in accordance with DIN 1045, heated and unheated cement-based screeds and non in accordance with DIN 18560, old, well-bonded tile finishes and rapid cement-based screeds. MULTIPLAN-50 FI is also suitable for use on plywood overlay, on chipboard and on old wooden floorboards as well.
Substrates:
On timber floorboards
On old substrates with bonded adhesive and levelling compound residues
For the restoration and repair of wooden floors and additionally for screeds and substrates in old and new construction
For producing flat, absorbent, high-strength installation surfaces for textile and elastic floor finishes as well as for ceramic tiles
Suitable for use on heated substrates
Features:
Fibre-reinforced, suitable on plywood overlay
Suitable on underfloor heating
Fast curing, foot traffic after 2-3 hours*
Flexible, polymer modified
Low emission
Easy to process, can be pump applied
For layers 1-50 mm thick
For interior applications only
EN 13813 CT-C30-F7